Welcome to second edition of “Digital Integrated Circuits: A Design Perspective.” In the six years since the publication of the first, the field of digital integrated circuits has gone through some dramatic evolutions and changes. IC manufacturing technology has continued to scale ever-smaller dimensions. Minimum feature sizes have scaled by a factor of almost ten since the writing of the first edition, and now are approaching the 100 nm realm. This scaling has a double impact on the design of digital integrated circuit. First of all, the complexity of the designs that can be put on a single die has increased dramatically. Dealing with the challenges this poses has led to new design methodologies and implementation strategies. At the same time, the plunge into the deep-submicron space causes devices to behave differently, and brings to the forefront a number of new issues that impact the reliability, cost, performance, and power dissipation of the digital IC. Addressing these issues in-depth is what differentiates this edition from the first.

A glance through the table of contents reveals extended coverage of issues such as deep-sub micron devices, circuit optimization, interconnect modeling and optimization, signal integrity, clocking and timing, and power dissipation. All these topics are illustrated with state-of-the-art design examples. Also, since MOS now represents more than 99% of the digital IC market, older technologies such as silicon bipolar and GaAs have been deleted (however, the interested reader can find the old chapters on these technologies on the web site of the book). Given the importance of methodology in today’s design process, we have included Design Methodology Inserts throughout the text, each of which highlights one particular aspect of the design process.

This new edition represents a major reworking of the book. The biggest change is the addition of two co-authors, Anantha and Bora, who have brought a broader insight into digital IC design and its latest trends and challenges.